In Samsung’s rebuttal of a plot to import HBM cache tech from its rival Hynix, Samsung is playing all its best cards at a time when its future with Apple is shaky. HBM (high-bandwidth memory) is an indispensable part of various AI solutions and many other demanding utilizations.
Chatter spread quickly following Khynix’s producing chip success under the process called ‘mass reflow molded underfill’ (MR-MUF), which was used for the HBM kind of chips Concerning that, Samsung believes that this may be a better method than their existing non-conductive film technology that might be lacking in terms of dealing with parallel complex, multi-chip packages.
Despite that, Samsung has down-torpedoed all these rumors. A corporation representative categorically denied making such decisions to use MR-MUF instead of the productive way nor rejected the speculations on their yields. Therefore, this rebuttal stresses building of the image of Samsung who is not afraid of competition and is ready to answer without worries.
Samsung’s company’s positioning on the topic puts constraints on the level of detail of its production process. This clearly cannot be implied that the company has given up with its favorite strategy which is internal innovation. This could start a discussion of irony given the fact that the two tech companies are coming up with improved HBM technology in a bid to be on the forefront as the AI market keeps on evolving.
